Elec Port uses our In-House Lab & third-party lab where we provide a variety of services tailored to electronic component quality assurance, including counterfeit detection, quality verification, and performance validation. All electronic components we receive—whether active parts like ICs, MCUs, and memory chips or passive components such as capacitors, resistors, and inductors—are rigorously inspected to verify conformance to both Customer and Manufacturer specifications. Some of the methods we utilize include:
We only source from original manufacturers and authorized distributors. Materials are categorized by risk level and inspected accordingly to reduce quality issues from the start.
Equipped with professional tools and data systems, our lab supports anti-counterfeit checks, failure analysis, and reliability testing—all aligned with industry standards.
Every part is inspected by our IQC team before warehousing. Tests follow AS6081, GJB-548C, MIL-STD-883, and other global standards, with results verified against golden samples to ensure accuracy.
All inspection steps are digitized and system-verified to avoid errors—ensuring full process visibility and consistent quality at every stage.
Used for authenticity checks and DPA testing. Identifies signs of resurfacing, remarking, coating, packaging defects, and dimension inconsistencies. Based on AS6081 and MIL-STD-883.
Detects internal defects such as voids, contamination, and wire bonding issues. Also used for counterfeit analysis by comparing internal structure with golden samples. Based on MIL-STD-883 and GJB-548C.
Exposes the die to verify markings, structure, and potential damage. Used to confirm authenticity and inspect bond wires and die condition. Based on MIL-STD-883 and GJB-548C.
Verifies the component’s ability to be soldered under standard conditions to identify risks like cold solder, open circuits, or dry joints. Conducted using dip-and-look methods. Based on J-STD.
Builds reference circuits per datasheets to test the component’s functional parameters under real conditions. Based on GJB-128B.
Uses tools like semiconductor analyzers and curve tracers to verify performance against specifications, checking for shorts, opens, or impedance issues. Based on MIL-STD-883L-2019 3005.1.
A non-destructive method to detect delamination, cracks, and voids inside the chip. Widely used in reliability and failure analysis.
Analyzes surface composition and structure at high resolution to detect material anomalies or structural defects using secondary and backscattered electrons and X-rays.
